Philips Switch ISP1122 User Manual

ISP1122  
Universal Serial Bus stand-alone hub  
Rev. 03 — 29 March 2000  
Product specification  
1. General description  
The ISP1122 is a stand-alone Universal Serial Bus (USB) hub device which complies  
with USB Specification Rev. 1.1. It integrates a Serial Interface Engine (SIE), hub  
repeater, hub controller, USB data transceivers and a 3.3 V voltage regulator. It has a  
configurable number of downstream ports, ranging from 2 to 5.  
The ISP1122 can be bus-powered, self-powered or hybrid-powered. When it is  
hybrid-powered the hub functions are powered by the upstream power supply (VBUS),  
but the downstream ports are powered by an external 5 Volt supply. The low power  
consumption in ‘suspend’ mode allows easy design of equipment that is compliant  
with the ACPI™, OnNow™ and USB power management requirements.  
The ISP1122 has built-in overcurrent sense inputs, supporting individual and global  
overcurrent protection for downstream ports. All ports (including the hub) have  
GoodLink™ indicator outputs for easy visual monitoring of USB traffic. The ISP1122  
has a serial I2C-bus interface for external EEPROM access and a reduced frequency  
(6 MHz) crystal oscillator. These features allow significant cost savings in system  
design and easy implementation of advanced USB functionality into PC peripherals.  
2. Features  
c
c
High performance USB hub device with integrated hub repeater, hub controller,  
Serial Interface Engine (SIE), data transceivers and 3.3 V voltage regulator  
Complies with Universal Serial Bus Specification Rev. 1.1 and ACPI, OnNow and  
USB power management requirements  
Configurable from 2 to 5 downstream ports with automatic speed detection  
Internal power-on reset and low voltage reset circuit  
Supports bus-powered, hybrid-powered and self-powered application  
Individual or ganged power switching for downstream ports  
Individual or global port overcurrent protection with built-in sense circuits  
6 MHz crystal oscillator with on-chip PLL for low EMI  
Visual USB traffic monitoring (GoodLink™) for hub and downstream ports  
I2C-bus interface to read vendor ID, product ID and configuration bits from  
external EEPROM  
Operation over the extended USB bus voltage range (4.0 to 5.5 V)  
Operating temperature range 40 to +85 °C  
8 kV in-circuit ESD protection for lower cost of external components  
 
   
ISP1122  
USB stand-alone hub  
Philips Semiconductors  
5. Pinning information  
5.1 ISP1122D (SO32) and ISP1122NB (SDIP32)  
5.1.1 Pinning  
handbook, halfpage  
V
handbook, halfpage  
V
reg(3.3)  
1
2
32  
1
2
32  
reg(3.3)  
PSW1/GL1  
DP2  
PSW1/GL1  
DP2  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
PSW2/GL2  
GND  
PSW2/GL2  
GND  
DM2  
DM2  
3
3
DM3  
DP0  
DM3  
DP0  
4
4
DP3  
DM0  
DP3  
DM0  
5
5
V
V
DP1  
DP1  
6
6
CC  
CC  
DM1  
DM1  
7
7
OC1  
OC2  
OC1  
OC2  
DP5  
DP5  
8
8
ISP1122D  
ISP1122NB  
DM5  
DM5  
9
9
OC3  
OC3  
INDV/SDA  
OPTION/SCL  
INDV/SDA  
OPTION/SCL  
10  
11  
12  
13  
14  
15  
16  
10  
11  
12  
13  
14  
15  
16  
OC4  
OC4  
OC5/GOC  
DM4  
OC5/GOC  
DM4  
RESET  
XTAL2  
XTAL1  
RESET  
XTAL2  
XTAL1  
DP4  
DP4  
SP/BP  
HUBGL  
SP/BP  
HUBGL  
PSW5/GL5/GPSW  
PSW4/GL4  
PSW5/GL5/GPSW  
PSW4/GL4  
PSW3/GL3  
PSW3/GL3  
MGR772  
MGR773  
Fig 2. Pin configuration SO32.  
Fig 3. Pin configuration SDIP32.  
5.1.2 Pin description  
Table 2: Pin description for SO32 and SDIP32  
Symbol[1]  
Pin  
Type Description  
[2]  
Vreg(3.3)  
1
-
regulated supply voltage (3.3 V ± 10%) from internal  
regulator; used to connect pull-up resistor on DP0 line  
PSW2/GL2[3]  
2
O
modes 4 to 6: power switch control output for downstream  
port 2 (open-drain, 6 mA)  
modes 0 to 3, 7: GoodLink LED indicator output for  
downstream port 2 (open-drain, 6 mA); to connect an LED  
use a 330 series resistor  
GND  
DM3  
DP3  
VCC  
3
4
5
6
-
ground supply  
AI/O downstream port 3 Dconnection (analog) [4]  
AI/O downstream port 3 D+ connection (analog) [4]  
-
supply voltage; connect to USB supply VBUS (bus-powered or  
hybrid-powered) or to local supply VDD (self-powered)  
OC1  
7
AI/I  
overcurrent sense input for downstream port 1 (analog[5]  
)
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© Philips Electronics N.V. 2000. All rights reserved.  
Product specification  
Rev. 03 — 29 March 2000  
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Table 2: Pin description for SO32 and SDIP32…continued  
Symbol[1]  
Pin  
8
Type Description  
OC2  
AI/I  
AI/I  
AI/I  
AI/I  
overcurrent sense input for downstream port 2 (analog[5]  
overcurrent sense input for downstream port 3 (analog[5]  
overcurrent sense input for downstream port 4 (analog[5]  
)
)
)
OC3  
9
OC4  
OC5/GOC[3]  
10  
11  
modes 5, 7: overcurrent sense input for downstream port 5  
(analog[5]  
modes 0, 1, 3: global overcurrent sense input (analog[5]  
)
)
DM4  
12  
13  
14  
AI/O downstream port 4 Dconnection (analog)[4]  
AI/O downstream port 4 D+ connection (analog) [4]  
DP4  
SP/BP  
I
selects power mode:  
self-powered: connect to VDD (local power supply); also use  
this mode for hybrid-powered operation  
bus-powered: connect to GND; disable downstream port 5 to  
meet supply current requirements[4]  
HUBGL  
15  
O
O
hub GoodLink LED indicator output (open-drain, 6 mA);  
to connect an LED use a 330 series resistor; if unused  
connect to VCC via a 10 kresistor  
PSW3/GL3[3] 16  
modes 4 to 6: power switch control output for downstream  
port 3 (open-drain, 6 mA)  
modes 0 to 3, 7: GoodLink LED indicator output for  
downstream port 3 (open-drain, 6 mA); to connect an LED  
use a 330 series resistor  
PSW4/GL4[3] 17  
O
O
modes 4 to 6: power switch control output for downstream  
port 4 (open-drain, 6 mA)  
modes 0 to 3, 7: GoodLink LED indicator output for  
downstream port 4 (open-drain, 6 mA); to connect an LED  
use a 330 series resistor  
PSW5/GL5/  
GPSW[3]  
18  
mode 5: power switch control output for downstream port 5  
(open-drain, 6 mA)  
modes 3, 7: GoodLink LED indicator output for downstream  
port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω  
series resistor  
modes 0 to 2: gang mode power switch control output  
(open-drain, 6 mA)  
XTAL1  
19  
20  
21  
I
crystal oscillator input (6 MHz)  
crystal oscillator output (6 MHz)  
XTAL2  
RESET[2]  
O
I
reset input (Schmitt trigger); a LOW level produces an  
asynchronous reset; connect to VCC for power-on reset  
(internal POR circuit)  
OPTION/SCL 22  
I/O  
I/O  
mode selection input; also functions as I2C-bus clock output  
(open-drain, 6 mA)  
INDV/SDA  
23  
selects individual (HIGH) or global (LOW) power switching  
I2C-bus data line (open-drain, 6 mA)  
DM5  
DP5  
DM1  
24  
25  
26  
AI/O downstream port 5 Dconnection (analog)[4]  
AI/O downstream port 5 D+ connection (analog) [4]  
AI/O downstream port 1 Dconnection (analog) [6]  
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© Philips Electronics N.V. 2000. All rights reserved.  
Product specification  
Rev. 03 — 29 March 2000  
 
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ISP1122  
USB stand-alone hub  
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Table 2: Pin description for SO32 and SDIP32…continued  
Symbol[1]  
Pin  
27  
28  
29  
30  
31  
Type Description  
DP1  
DM0  
DP0  
DM2  
DP2  
AI/O downstream port 1 D+ connection (analog) [6]  
AI/O upstream port Dconnection (analog)  
AI/O upstream port D+ connection (analog)  
AI/O downstream port 2 Dconnection (analog) [6]  
AI/O downstream port 2 D+ connection (analog) [6]  
PSW1/GL1[3] 32  
O
modes 4 to 6: power switch control output for downstream  
port 1 (open-drain, 6 mA)  
modes 0 to 3, 7: GoodLink LED indicator output for  
downstream port 1 (open-drain, 6 mA); to connect an LED  
use a 330 series resistor  
[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.  
[2] The voltage at pin Vreg(3.3) is gated by the RESET pin. This allows fully self-powered operation by  
connecting RESET to VBUS (+5 V USB supply). If VBUS is lost upstream port D+ will not be driven.  
[3] See Table 4 “Mode selection”.  
[4] To disable a downstream port connect both D+ and Dto VCC via a 1 Mresistor; unused ports must  
be disabled in reverse order starting from port 5.  
[5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,  
the pin functions as a logic input (TTL level).  
[6] Downstream ports 1 and 2 cannot be disabled.  
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© Philips Electronics N.V. 2000. All rights reserved.  
Product specification  
Rev. 03 — 29 March 2000  
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5.2 ISP1122BD (LQFP32)  
5.2.1 Pinning  
DP3  
1
2
3
4
5
6
7
8
24 DM0  
V
23 DP1  
CC  
OC1  
OC2  
22 DM1  
21 DP5  
ISP1122BD  
OC3  
20 DM5  
OC4  
19 INDV/SDA  
18 OPTION/SCL  
17 RESET  
OC5/GOC  
DM4  
MBL018  
Fig 4. Pin configuration LQFP32.  
5.2.2 Pin description  
Table 3: Pin description for LQFP32  
Symbol[1]  
Pin  
Type Description  
[2]  
Vreg(3.3)  
29  
-
regulated supply voltage (3.3 V ± 10%) from internal  
regulator; used to connect pull-up resistor on DP0 line  
PSW2/GL2[3] 30  
O
modes 4 to 6: power switch control output for downstream  
port 2 (open-drain, 6 mA)  
modes 0 to 3, 7: GoodLink LED indicator output for  
downstream port 2 (open-drain, 6 mA); to connect an LED  
use a 330 series resistor  
GND  
DM3  
DP3  
VCC  
31  
32  
1
-
ground supply  
AI/O downstream port 3 Dconnection (analog) [4]  
AI/O downstream port 3 D+ connection (analog) [4]  
2
-
supply voltage; connect to USB supply VBUS (bus-powered or  
hybrid-powered) or to local supply VDD (self-powered)  
OC1  
OC2  
OC3  
OC4  
3
4
5
6
AI/I  
AI/I  
AI/I  
AI/I  
overcurrent sense input for downstream port 1 (analog[5]  
overcurrent sense input for downstream port 2 (analog[5]  
overcurrent sense input for downstream port 3 (analog[5]  
overcurrent sense input for downstream port 4 (analog[5]  
)
)
)
)
9397 750 07002  
© Philips Electronics N.V. 2000. All rights reserved.  
Product specification  
Rev. 03 — 29 March 2000  
6 of 48  
 
     
ISP1122  
USB stand-alone hub  
Philips Semiconductors  
Table 3: Pin description for LQFP32…continued  
Symbol[1]  
OC5/GOC[3]  
Pin  
AI/I modes 5, 7: overcurrent sense input for downstream port 5  
(analog[5]  
modes 0, 1, 3: global overcurrent sense input (analog[5]  
7
)
)
DM4  
8
AI/O downstream port 4 Dconnection (analog)[4]  
DP4  
9
AI/O downstream port 4 D+ connection (analog) [4]  
SP/BP  
10  
I
selects power mode:  
self-powered: connect to VDD (local power supply); also use  
this mode for hybrid-powered operation  
bus-powered: connect to GND; disable downstream port 5 to  
meet supply current requirements[4]  
HUBGL  
11  
O
O
hub GoodLink LED indicator output (open-drain, 6 mA);  
to connect an LED use a 330 series resistor; if unused  
connect to VCC via a 10 kresistor  
PSW3/GL3[3] 12  
modes 4 to 6: power switch control output for downstream  
port 3 (open-drain, 6 mA)  
modes 0 to 3, 7: GoodLink LED indicator output for  
downstream port 3 (open-drain, 6 mA); to connect an LED  
use a 330 series resistor  
PSW4/GL4[3] 13  
O
O
modes 4 to 6: power switch control output for downstream  
port 4 (open-drain, 6 mA)  
modes 0 to 3, 7: GoodLink LED indicator output for  
downstream port 4 (open-drain, 6 mA); to connect an LED  
use a 330 series resistor  
PSW5/GL5/  
GPSW[3]  
14  
mode 5: power switch control output for downstream port 5  
(open-drain, 6 mA)  
modes 3, 7: GoodLink LED indicator output for downstream  
port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω  
series resistor  
modes 0 to 2: gang mode power switch control output  
(open-drain, 6 mA)  
XTAL1  
15  
16  
17  
I
crystal oscillator input (6 MHz)  
crystal oscillator output (6 MHz)  
XTAL2  
RESET[2]  
O
I
reset input (Schmitt trigger); a LOW level produces an  
asynchronous reset; connect to VCC for power-on reset  
(internal POR circuit)  
OPTION/SCL 18  
I/O  
I/O  
mode selection input; also functions as I2C-bus clock output  
(open-drain, 6 mA)  
INDV/SDA  
19  
selects individual (HIGH) or global (LOW) power switching  
I2C-bus data line (open-drain, 6 mA)  
DM5  
DP5  
DM1  
DP1  
DM0  
DP0  
20  
21  
22  
23  
24  
25  
AI/O downstream port 5 Dconnection (analog)[4]  
AI/O downstream port 5 D+ connection (analog) [4]  
AI/O downstream port 1 Dconnection (analog) [6]  
AI/O downstream port 1 D+ connection (analog) [6]  
AI/O upstream port Dconnection (analog)  
AI/O upstream port D+ connection (analog)  
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© Philips Electronics N.V. 2000. All rights reserved.  
Product specification  
Rev. 03 — 29 March 2000  
 
7 of 48  
ISP1122  
USB stand-alone hub  
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Table 3: Pin description for LQFP32…continued  
Symbol[1]  
Pin  
26  
Type Description  
AI/O downstream port 2 Dconnection (analog) [6]  
DM2  
DP2  
27  
AI/O downstream port 2 D+ connection (analog) [6]  
PSW1/GL1[3] 28  
O
modes 4 to 6: power switch control output for downstream  
port 1 (open-drain, 6 mA)  
modes 0 to 3, 7: GoodLink LED indicator output for  
downstream port 1 (open-drain, 6 mA); to connect an LED  
use a 330 series resistor  
[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals.  
[2] The voltage at pin Vreg(3.3) is gated by the RESET pin. This allows fully self-powered operation by  
connecting RESET to VBUS (+5 V USB supply). If VBUS is lost upstream port D+ will not be driven.  
[3] See Table 4 “Mode selection”.  
[4] To disable a downstream port connect both D+ and Dto VCC via a 1 Mresistor; unused ports must  
be disabled in reverse order starting from port 5.  
[5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,  
the pin functions as a logic input (TTL level).  
[6] Downstream ports 1 and 2 cannot be disabled.  
6. Functional description  
The ISP1122 is a stand-alone USB hub with up to 5 downstream ports. The number  
of ports can be configured between 2 and 5. The downstream ports can be used to  
connect low-speed or full-speed USB peripherals. All standard USB requests from  
the host are handled by the hardware without the need for firmware intervention. The  
block diagram is shown in Figure 1.  
The ISP1122 requires only a single supply voltage. An internal 3.3 V regulator  
provides the supply voltage for the analog USB data transceivers.  
The ISP1122 supports both bus-powered and self-powered hub operation. When  
using bus-powered operation a downstream port cannot supply more than 100 mA to  
a peripheral. In case of self-powered operation an external supply is used to power  
the downstream ports, allowing a current consumption of max. 500 mA per port.  
A basic I2C-bus interface is provided for reading vendor ID, product ID and  
configuration bits from an external EEPROM upon a reset.  
6.1 Analog transceivers  
The integrated transceiver interfaces directly to the USB cables through external  
termination resistors. They are capable of transmitting and receiving serial data at  
both ‘full-speed’ (12 Mbit/s) and ‘low-speed’ (1.5 Mbit/s) data rates. The slew rates  
are adjusted according to the speed of the device connected and lie within the range  
mentioned in the USB Specification Rev. 1.1.  
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Product specification  
Rev. 03 — 29 March 2000  
8 of 48  
 
               
ISP1122  
USB stand-alone hub  
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6.2 Philips Serial Interface Engine (SIE)  
The Philips SIE implements the full USB protocol layer. It is completely hardwired for  
speed and needs no firmware intervention. The functions of this block include:  
synchronization pattern recognition, parallel/serial conversion, bit (de-)stuffing, CRC  
checking/generation, Packet IDentifier (PID) verification/generation, address  
recognition, handshake evaluation/generation.  
6.3 Hub repeater  
The hub repeater is responsible for managing connectivity on a ‘per packet’ basis. It  
implements ‘packet signalling’ and ‘resume’ connectivity. Low-speed devices can be  
connected to downstream ports. If a low-speed device is detected the repeater will  
not propagate upstream packets to the corresponding port, unless they are preceded  
by a PREAMBLE PID.  
6.4 End-of-frame timers  
This block contains the specified EOF1 and EOF2 timers which are used to detect  
‘loss-of-activity’ and ‘babble’ error conditions in the hub repeater. The timers also  
maintain the low-speed keep-alive strobe which is sent at the beginning of a frame.  
6.5 General and individual port controller  
The general and individual port controllers together provide status and control of  
individual downstream ports. Any port status change will be reported to the host via  
the hub status change (interrupt) endpoint.  
6.6 GoodLink  
Indication of a good USB connection is provided through GoodLink technology. An  
LED can be directly connected via an external 330 resistor.  
During enumeration the LED blinks on momentarily. After successful configuration of  
the ISP1122, the LED is permanently on. The LED blinks off for 100 ms upon each  
successful packet transfer (with ACK). The hub GoodLink indicator blinks when the  
hub receives a packet addressed to it. Downstream GoodLink indicators blink upon  
an acknowledgment from the associated port. In ‘suspend’ mode the LED is off.  
This feature provides a user-friendly indication of the status of the hub, the connected  
downstream devices and the USB traffic. It is a useful diagnostics tool to isolate faulty  
USB equipment and helps to reduce field support and hotline costs.  
6.7 Bit clock recovery  
The bit clock recovery circuit recovers the clock from the incoming USB data stream  
using a 4× oversampling principle. It is able to track jitter and frequency drift as  
specified by the USB Specification Rev. 1.1.  
6.8 Voltage regulator  
A 5 to 3.3 V DC-DC regulator is integrated on-chip to supply the analog transceiver  
and internal logic. This can also be used to supply the terminal 1.5 kpull-up resistor  
on the D+ line of the upstream connection.  
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Product specification  
Rev. 03 — 29 March 2000  
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6.9 PLL clock multiplier  
A 6 to 48 MHz clock multiplier Phase-Locked Loop (PLL) is integrated on-chip. This  
allows for the use of low-cost 6 MHz crystals. The low crystal frequency also  
minimizes Electro-Magnetic Interference (EMI). The PLL requires no external  
components.  
6.10 Overcurrent detection  
An overcurrent detection circuit for downstream ports has been integrated on-chip. It  
is self-reporting, resets automatically, has a low trip time and requires no external  
components. Both individual and global overcurrent detection are supported.  
6.11 I2C-bus interface  
A basic serial I2C-bus interface (single master, 100 kHz) is provided to read VID, PID  
and configuration bits from an external I2C-bus EEPROM (e.g. Philips PCF8582 or  
equivalent). At reset the ISP1122 reads 6 bytes of data from the external memory.  
The I2C-bus interface timing complies with the standard mode of operation as  
described in The I2C-bus and how to use it, order number 9398 393 40011.  
7. Modes of operation  
The ISP1122 has several modes of operation, each corresponding with a different pin  
configuration. Modes are selected by means of pins INDV, OPTION and SP/BP, as  
shown in Table 4.  
Mode  
INDV  
OPTION SP/BP  
PSWn/GLn  
(n = 1 to 4)  
PSW5/GL5/GPSW OCn  
(n = 1 to 4)  
OC5/GOC  
[1]  
[2]  
0
1
2
3
4
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
GoodLink  
ganged power  
ganged power  
ganged power  
GoodLink[4]  
inactive  
inactive  
inactive  
inactive [3]  
inactive  
global overcurrent  
global overcurrent  
inactive[3]  
GoodLink  
GoodLink  
GoodLink[4]  
global overcurrent  
inactive  
individual power  
individual  
overcurrent  
5
1
0
1
individual power  
individual power  
overcurrent  
overcurrent  
6
7
1
1
1
1
0
1
individual power  
GoodLink[4]  
inactive  
GoodLink[4]  
inactive [3]  
inactive[3]  
individual  
individual  
overcurrent  
overcurrent  
[1] Port power switching: logic 0 = ganged, logic 1 = individual.  
[2] Power mode: logic 0 = bus-powered, logic 1 = self-powered (or hybrid-powered).  
[3] No overcurrent detection.  
[4] No power switching.  
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Product specification  
Rev. 03 — 29 March 2000  
 
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8. Endpoint descriptions  
Each USB device is logically composed of several independent endpoints. An  
endpoint acts as a terminus of a communication flow between the host and the  
device. At design time each endpoint is assigned a unique number (endpoint  
identifier, see Table 5). The combination of the device address (given by the host  
during enumeration), the endpoint number and the transfer direction allows each  
endpoint to be uniquely referenced.  
The ISP1122 has two endpoints, endpoint 0 (control) and endpoint 1 (interrupt).  
Table 5: Hub endpoints  
Function  
Ports  
Endpoint  
identifier  
Transfer  
type  
Direction[1] Max. packet  
size (bytes)  
OUT  
IN  
64  
64  
1
0
1
control  
0: upstream  
Hub  
1 to 5: downstream  
interrupt  
IN  
[1] IN: input for the USB host; OUT: output from the USB host.  
8.1 Hub endpoint 0 (control)  
All USB devices and functions must implement a default control endpoint (ID = 0).  
This endpoint is used by the host to configure the device and to perform generic USB  
status and control access.  
The ISP1122 hub supports the following USB descriptor information through its  
control endpoint 0, which can handle transfers of 64 bytes maximum:  
Device descriptor  
Configuration descriptor  
Interface descriptor  
Endpoint descriptor  
Hub descriptor  
String descriptor.  
8.2 Hub endpoint 1 (interrupt)  
Endpoint 1 is used by the ISP1122 hub to provide status change information to the  
host. This endpoint can be accessed only after the hub has been configured by the  
host (by sending the Set Configuration command).  
Endpoint 1 is an interrupt endpoint: the host polls it once every 255 ms by sending an  
AcKnowledge) response to this request, otherwise it sends the Status Change byte  
(see Table 6).  
9397 750 07002  
© Philips Electronics N.V. 2000. All rights reserved.  
Product specification  
Rev. 03 — 29 March 2000  
11 of 48  
 
         
ISP1122  
USB stand-alone hub  
Philips Semiconductors  
Table 6: Status Change byte: bit allocation  
Bit  
0
Symbol  
Description  
Hub SC  
a logic 1 indicates a status change on the hub’s upstream port  
a logic 1 indicates a status change on downstream port 1  
a logic 1 indicates a status change on downstream port 2  
a logic 1 indicates a status change on downstream port 3  
a logic 1 indicates a status change on downstream port 4  
a logic 1 indicates a status change on downstream port 5  
not used  
1
Port 1 SC  
Port 2 SC  
Port 3 SC  
Port 4 SC  
Port 5 SC  
reserved  
reserved  
2
3
4
5
6
7
not used  
9. Host requests  
The ISP1122 handles all standard USB requests from the host via control endpoint 0.  
The control endpoint can handle a maximum of 64 bytes per transfer.  
Remark: Please note that the USB data transmission order is Least Significant Bit  
(LSB) first. In the following tables multi-byte variables are displayed least significant  
byte first.  
9.1 Standard requests  
Table 7 shows the supported standard USB requests. Some requests are explicitly  
unsupported. All other requests will be responded with a STALL packet.  
Table 7: Standard USB requests  
Request name  
bmRequestType bRequest  
wValue  
byte 2, 3  
(Hex)  
wIndex  
byte 4, 5  
(Hex)  
wLength  
byte 6, 7  
(Hex)  
Data  
byte 0 [7:0]  
(Bin)  
byte 1  
(Hex)  
Address  
Set Address  
Configuration  
Get Configuration  
X000 0000  
1000 0000  
05  
08  
address[1]  
00, 00  
00, 00  
00, 00  
00, 00  
01, 00  
none  
configuration  
value = 01H  
Set Configuration (0)  
Set Configuration (1)  
Descriptor  
X000 0000  
X000 0000  
09  
09  
00, 00  
01, 00  
00, 00  
00, 00  
00, 00  
00, 00  
none  
none  
Get Configuration  
Descriptor  
1000 0000  
06  
00, 02  
00, 00  
length[2]  
configuration,  
interface and  
endpoint  
descriptors  
Get Device Descriptor  
1000 0000  
06  
06  
06  
06  
00, 01  
03, 00  
03, 01  
03, 02  
00, 00  
00, 00  
00, 00  
00, 00  
length[2]  
length[2]  
length[2]  
length[2]  
device  
descriptor  
Get String Descriptor (0) 1000 0000  
Get String Descriptor (1) 1000 0000  
Get String Descriptor (2) 1000 0000  
language ID  
string  
manufacturer  
string  
product string  
9397 750 07002  
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Product specification  
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Table 7: Standard USB requests…continued  
Request name  
bmRequestType bRequest  
wValue  
byte 2, 3  
(Hex)  
wIndex  
byte 4, 5  
(Hex)  
wLength  
byte 6, 7  
(Hex)  
Data  
byte 0 [7:0]  
(Bin)  
byte 1  
(Hex)  
Feature  
Clear Device Feature  
(REMOTE_WAKEUP)  
X000 0000  
X000 0010  
X000 0000  
X000 0010  
01  
01  
03  
03  
01, 00  
00, 00  
01, 00  
00, 00  
00, 00  
81, 00  
00, 00  
81, 00  
00, 00  
00, 00  
00, 00  
00, 00  
none  
none  
none  
none  
Clear Endpoint (1)  
Feature (HALT/STALL)  
Set Device Feature  
(REMOTE_WAKEUP)  
Set Endpoint (1)  
Feature (HALT/STALL)  
Status  
Get Device Status  
Get Interface Status  
Get Endpoint (0) Status  
1000 0000  
1000 0001  
1000 0010  
00  
00  
00  
00, 00  
00, 00  
00, 00  
00, 00  
00, 00  
02, 00  
02, 00  
device status  
zero  
00/80[3], 00 02, 00  
endpoint 0  
status  
Get Endpoint (1) Status  
1000 0010  
0000 0000  
00  
07  
00, 00  
81, 00  
02, 00  
endpoint 1  
status  
Unsupported  
Set Descriptor  
XX, XX  
XX, XX  
XX, XX  
descriptor;  
STALL  
Get Interface  
Set Interface  
Synch Frame  
1000 0001  
X000 0001  
1000 0010  
0A  
0B  
0C  
00, 00  
XX, XX  
00, 00  
XX, XX  
XX, XX  
XX, XX  
01, 00  
00, 00  
02, 00  
STALL  
STALL  
STALL  
[1] Device address: 0 to 127.  
[2] Returned value in bytes.  
[3] MSB specifies endpoint direction: 0 = OUT, 1 = IN. The ISP1122 accepts either value.  
In Table 8 the supported hub specific requests are listed, as well as some  
unsupported requests. Table 9 provides the feature selectors for setting or clearing  
port features.  
Table 8: Hub specific requests  
Request name  
bmRequestType bRequest  
wValue  
byte 2, 3  
(Hex)  
wIndex  
byte 4, 5  
(Hex)  
wLength  
byte 6, 7  
(Hex)  
Data  
byte 0 [7:0]  
(Bin)  
byte 1  
(Hex)  
Descriptor  
Get Hub Descriptor  
Feature  
1010 0000  
06  
00, 00/29[1] 00, 00  
length[2], 00 hub descriptor  
Clear Hub Feature  
(C_LOCAL_POWER)  
X010 0000  
X010 0011  
X010 0011  
01  
01  
03  
00, 00  
00, 00  
00, 00  
00, 00  
none  
none  
none  
Clear Port Feature  
(feature selectors)  
feature[3], 00 port [4], 00  
feature[3], 00 port [4], 00  
Set Port Feature  
(feature selectors)  
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Table 8: Hub specific requests…continued  
Request name  
bmRequestType bRequest  
wValue  
byte 2, 3  
(Hex)  
wIndex  
byte 4, 5  
(Hex)  
wLength  
byte 6, 7  
(Hex)  
Data  
byte 0 [7:0]  
(Bin)  
byte 1  
(Hex)  
Status  
Get Hub Status  
1010 0000  
1010 0011  
00  
00  
00, 00  
00, 00  
00, 00  
04, 00  
04, 00  
hub status and  
status change  
field  
Get Port Status  
Unsupported  
Get Bus Status  
port[4], 00  
port status  
1010 0011  
X010 0000  
02  
01  
00, 00  
01, 00  
port [4], 00  
00, 00  
01, 00  
00, 00  
STALL  
STALL  
Clear Hub Feature  
(C_OVER_CURRENT)  
Set Hub Descriptor  
0010 0000  
X010 0000  
07  
03  
XX, XX  
00, 00  
00, 00  
00, 00  
3E, 00  
00, 00  
STALL  
STALL  
Set Hub Feature  
(C_LOCAL_POWER)  
Set Hub Feature  
X010 0000  
03  
01, 00  
00, 00  
00, 00  
STALL  
(C_OVER_CURRENT)  
[1] USB Specification Rev. 1.0 uses 00H, USB Specification Rev. 1.1 specifies 29H.  
[2] Returned value in bytes.  
[3] Feature selector value, see Table 9.  
[4] Downstream port identifier: 1 to N with N = number of enabled ports (2 to 5).  
Table 9: Port feature selectors  
Feature selector name  
PORT_CONNECTION  
PORT_ENABLE  
Value (Hex) Set feature  
Clear feature  
00  
01  
02  
03  
04  
not used  
not used  
not used  
disables a port  
resumes a port  
not used  
PORT_SUSPEND  
PORT_OVERCURRENT  
PORT_RESET  
suspends a port  
not used  
resets and enables a not used  
port  
PORT_POWER  
08  
09  
10  
powers on a port  
not used  
powers off a port  
PORT_LOW_SPEED  
C_PORT_CONNECTION  
not used  
not used  
clears port connection  
change bit  
C_PORT_ENABLE  
11  
12  
not used  
not used  
not used  
not used  
clears port enable  
change bit  
C_PORT_SUSPEND  
clears port suspend  
change bit  
C_PORT_OVERCURRENT 13  
clears port overcurrent  
change bit  
C_PORT_RESET  
14  
clears port reset  
change bit  
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9.3 Descriptors  
The ISP1122 hub controller supports the following standard USB descriptors:  
Device  
Configuration  
Interface  
Endpoint  
Hub  
String.  
Table 10: Device descriptor  
Values in square brackets are optional.  
Offset  
(bytes)  
Field name  
Size  
Value  
Comments  
(bytes) (Hex)  
0
1
2
4
5
6
7
8
bLength  
1
1
2
1
1
1
1
2
12  
descriptor length = 18 bytes  
type = DEVICE  
USB Specification Rev. 1.1  
HUB_CLASSCODE  
-
bDescriptorType  
bcdUSB  
01  
10, 01  
09  
bDeviceClass  
bDeviceSubClass  
bDeviceProtocol  
bMaxPacketSize0  
idVendor  
00  
00  
-
40  
packet size = 64 bytes  
(04CC); can be customized using an  
external EEPROM (see Table 23)  
10  
idProduct  
2
22, 11  
customized using an external  
EEPROM (see Table 23)  
12  
14  
bcdDevice  
2
1
01, 01  
device release 1.1; silicon revision  
increments this value  
iManufacturer  
00  
no manufacturer string (default)  
[01]  
manufacturer string enabled  
(using an external EEPROM)  
15  
iProduct  
1
00  
no product string (default)  
[02]  
product string enabled  
(using an external EEPROM)  
16  
17  
iSerialNumber  
1
1
00  
01  
no serial number string  
one configuration  
bNumConfigurations  
9397 750 07002  
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Table 11: Configuration descriptor  
Values in square brackets are optional.  
Offset  
(bytes)  
Field name  
Size  
Value  
Comments  
(bytes) (Hex)  
0
1
2
bLength  
1
1
2
09  
descriptor length = 9 bytes  
type = CONFIGURATION  
bDescriptorType  
wTotalLength  
02  
19, 00  
total length of configuration, interface  
and endpoint descriptors (25 bytes)  
4
5
6
7
bNumInterfaces  
bConfigurationValue  
iConfiguration  
1
1
1
1
01  
one interface  
01  
configuration value = 1  
00  
no configuration string  
bmAttributes  
E0  
A0  
32  
self-powered with remote wake-up[1]  
bus-powered with remote wake-up[1]  
100 mA (default)  
8
MaxPower[2]  
1
[00]  
[FA]  
0 mA (using an external EEPROM)  
500 mA (using an external EEPROM)  
[1] Selected by input SP/BP.  
[2] Value in units of 2 mA.  
Table 12: Interface descriptor  
Offset  
(bytes)  
Field name  
Size  
Value  
Comments  
(bytes) (Hex)  
0
1
2
3
4
5
6
7
8
bLength  
1
1
1
1
1
1
1
1
1
09  
04  
00  
01  
01  
09  
00  
00  
00  
descriptor length = 9 bytes  
type = INTERFACE  
-
bDescriptorType  
bInterfaceNumber  
bAlternateSetting  
bNumEndpoints  
bInterfaceClass  
bInterfaceSubClass  
bInterfaceProtocol  
bInterface  
no alternate setting  
status change (interrupt) endpoint  
HUB_CLASSCODE  
-
no class-specific protocol  
no interface string  
Table 13: Endpoint descriptor  
Offset  
(bytes)  
Field name  
Size  
Value  
Comments  
(bytes) (Hex)  
0
1
2
3
4
6
bLength  
1
1
1
1
2
1
07  
descriptor length = 7 bytes  
type = ENDPOINT  
bDescriptorType  
bEndpointAddress  
bmAttributes  
wMaxPacketSize  
bInterval  
05  
81  
endpoint 1, direction: IN  
interrupt endpoint  
03  
01, 00  
FF  
packet size = 1 byte  
polling interval (255 ms)  
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Table 14: Hub descriptor  
Values in square brackets are optional.  
Offset  
(bytes)  
Field name  
Size  
Value  
Comments  
(bytes) (Hex)  
0
1
2
bDescLength  
bDescriptorType  
bNbrPorts  
1
1
1
09  
29  
descriptor length = 9 bytes  
type = HUB  
05 to 02 number of enabled downstream ports;  
selectable by DP/DM strapping  
3
wHubCharacteristics  
2
09, 00  
individual power switching[1]  
,
(modes 0, 1, 3, 4, 5, 7)  
11, 00  
individual power switching[1], no  
overcurrent protection (modes 2, 6) [2]  
5
6
bPwrOn2PwrGood[3]  
bHubContrCurrent  
1
1
32  
100 ms (default; modes 0, 1, 2, 4, 5, 6)  
0 ms (default; modes 3, 7)  
00  
[FA]  
500 ms (using an external EEPROM;  
modes 0, 1, 2, 4, 5, 6); see Table 23  
64  
maximum hub controller current  
(100 mA)  
7
8
DeviceRemovable  
PortPwrCtrlMask  
1
1
00  
FF  
all devices removable  
must be all ones for compatibility with  
USB Specification Rev. 1.0  
[1] ISP1122 always reports power management status on an individual basis, even for ganged/global  
modes. This is compliant with USB Specification Rev. 1.1.  
[2] Condition with no overcurrent detection is reported to the host.  
[3] Value in units of 2 ms.  
Table 15: String descriptors  
String descriptors are optional and therefore disabled by default; they can be enabled through  
an external EEPROM.  
Offset  
(bytes)  
Field name  
Size  
Value  
Comments  
(bytes) (Hex)  
String descriptor (0): language ID string  
0
1
2
bLength  
1
1
2
04  
descriptor length = 4 bytes  
type = STRING  
bDescriptorType  
bString  
03  
09, 04  
LANGID code zero  
String descriptor (1): manufacturer string  
0
1
2
bLength  
1
2E  
descriptor length = 46 bytes  
type = STRING  
bDescriptorType  
bString  
1
03  
UC[1]  
44  
“Philips Semiconductors”  
String descriptor (2): product string  
0
1
2
bLength  
1
10  
descriptor length = 16 bytes  
type = STRING  
bDescriptorType  
bString  
1
03  
UC[1]  
14  
“ISP1122”  
[1] Unicode encoded string.  
9397 750 07002  
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Product specification  
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9.4 Hub responses  
This section describes the hub responses to requests from the USB host.  
9.4.1 Get device status  
The hub returns 2 bytes, see Table 16.  
Table 16: Get device status response  
Bit #  
Function  
Value  
Description  
0
self-powered  
0
1
0
1
0
bus-powered  
self-powered  
no remote wake-up  
remote wake-up enabled  
-
1
remote wake-up  
reserved  
2 to 15  
9.4.2 Get configuration  
The hub returns 1 byte, see Table 17.  
Table 17: Get configuration response  
Bit #  
Function  
Value  
Description  
device not configured  
device configured  
-
0
configuration value  
0
1
0
1 to 7  
reserved  
9.4.3 Get interface status  
The hub returns 2 bytes, see Table 18.  
Table 18: Get interface status response  
Bit #  
Function  
Value  
Description  
0 to 15  
reserved  
0
-
9.4.4 Get hub status  
The hub returns 4 bytes, see Table 19.  
Table 19: Get hub status response  
Bit #  
Function  
Value  
Description  
0
local power source  
0
1
0
1
0
0
1
local power supply good  
local power supply lost  
no overcurrent condition  
hub overcurrent condition detected  
-
1
overcurrent indicator  
2 to 15  
16  
reserved  
local power status change  
no change in local power status  
local power status changed  
no change in overcurrent condition  
overcurrent condition changed  
-
17  
overcurrent indicator change 0  
1
18 to 31 reserved  
0
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9.4.5 Get port status  
The hub returns 4 bytes. The first 2 bytes contain the port status bits (wPortStatus,  
see Table 20). The last 2 bytes hold the port status change bits (wPortChange, see  
Table 21).  
Table 20: Get port status response (wPortStatus)  
Bit #  
Function  
Value  
Description  
0
current connect status  
0
1
0
1
0
1
0
1
0
1
0
0
1
0
1
0
no device present  
device present on this port  
port disabled  
1
2
3
4
port enabled/disabled  
suspend  
port enabled  
port not suspended  
port suspended  
no overcurrent condition  
overcurrent condition detected  
reset not asserted  
reset asserted  
overcurrent indicator  
reset  
5 to 7  
8
reserved  
-
port power  
port powered off  
port power on  
9
low-speed device attached  
full-speed device attached  
low-speed device attached  
-
10 to 15 reserved  
Table 21: Get port status response (wPortChange)  
Bit #  
Function  
Value  
Description  
0
connect status change  
0
1
0
1
0
1
no change in current connect status  
current connect status changed  
no port error  
1
port enabled/disabled  
change  
port disabled by a port error  
no change in suspend status  
resume complete  
2
suspend change  
3
overcurrent indicator change 0  
1
no change in overcurrent status  
overcurrent indicator changed  
no change in reset status  
reset complete  
4
reset change  
0
1
0
5 to 15  
reserved  
-
9397 750 07002  
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Product specification  
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9.4.6 Get configuration descriptor  
The hub returns 25 bytes containing the configuration descriptor (9 bytes, see  
Table 11), the interface descriptor (9 bytes, see Table 12) and the endpoint descriptor  
(7 bytes, see Table 13).  
9.4.7 Get device descriptor  
The hub returns 18 bytes containing the device descriptor, see Table 10.  
9.4.8 Get hub descriptor  
The hub returns 9 bytes containing the hub descriptor, see Table 14.  
9.4.9 Get string descriptor (0)  
The hub returns 4 bytes containing the language ID, see Table 15.  
9.4.10 Get string descriptor (1)  
The hub returns 46 bytes containing the manufacturer name, see Table 15.  
9.4.11 Get string descriptor (2)  
The hub returns 16 bytes containing the product name, see Table 15.  
10. I2C-bus interface  
A simple I2C-bus interface is provided in the ISP1122 to read customized vendor ID,  
product ID and some other configuration bits from an external EEPROM. The  
interface supports single master operation at a nominal bus speed of 93.75 kHz.  
The I2C-bus interface is intended for bidirectional communication between ICs via two  
serial bus wires, SDA (data) and SCL (clock). Both lines are driven by open-drain  
circuits and must be connected to the positive supply voltage via pull-up resistors.  
10.1 Protocol  
The I2C-bus protocol defines the following conditions:  
Bus free: both SDA and SCL are HIGH  
START: a HIGH-to-LOW transition on SDA, while SCL is HIGH  
STOP: a LOW-to-HIGH transition on SDA, while SCL is HIGH  
Data valid: after a START condition, data on SDA are stable during the HIGH  
period of SCL; data on SDA may only change while SCL is LOW.  
Each device on the I2C-bus has a unique slave address, which the master uses to  
select a device for access.  
The master starts a data transfer using a START condition and ends it by generating  
a STOP condition. Transfers can only be initiated when the bus is free. The receiver  
must acknowledge each byte by means of a LOW level on SDA during the ninth clock  
pulse on SCL.  
For detailed information please consult The I2C-bus and how to use it., order number  
9398 393 40011.  
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10.2 Hardware connections  
Via the I2C-bus interface the ISP1122 can be connected to an external EEPROM  
(PCF8582 or equivalent). The hardware connections are shown in Figure 5.  
The SCL and SDA pins are multiplexed with pins OPTION and INDV respectively.  
V
V
DD  
id
DD  
R
R
P
P
SCL  
SDA  
OPTION/SCL  
INDV/SDA  
A0  
A1  
A2  
2
I C-bus  
PCF8582  
ISP1122  
USB HUB  
EEPROM  
or  
equivalent  
MGR780  
Fig 5. EEPROM connection diagram.  
The slave address which ISP1122 uses to access the EEPROM is 1010000B. Page  
mode addressing is not supported, so pins A0, A1 and A2 of the EEPROM must be  
connected to GND (logic 0).  
10.3 Data transfer  
When the ISP1122 is reset, the I2C-bus interface tries to read 6 bytes of configuration  
data from an external EEPROM. If no response is detected, the levels on inputs SDA  
and SCL are interpreted as INDV and OPTION to select the operating mode (see  
Table 4).  
The data in the EEPROM memory are organized as shown in Table 22.  
Table 22: EEPROM organization  
Address  
(Hex)  
Default value  
(Hex)  
00  
01  
02  
03  
04  
05  
CC  
04  
22  
11  
-
idVendor [1] (lower byte)  
idVendor [1] (upper byte)  
idProduct [2] (lower byte)  
idProduct [2] (upper byte)  
configuration bits C7 to C0; see Table 23  
signature  
AA  
[1] Vendor ID code in the Device descriptor, see Table 10.  
[2] Product ID code in the Device descriptor, see Table 10.  
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Product specification  
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Table 23: Configuration bits  
Bit  
Function  
(Bin)  
C0  
C1  
C2  
C3  
OPTION  
see Table 4 “Mode selection”  
see Table 4 “Mode selection”  
INDV  
reserved  
PwrOn2PwrGood[2]  
0[1]  
0[1]  
1
must always be programmed to logic 0  
100 ms (bPwrOn2PwrGood = 32H)  
500 ms (bPwrOn2PwrGood = FAH)  
string descriptors disabled  
C4  
C5  
string descriptor enable  
0[1]  
1
string descriptors enabled (strings:  
“Philips Semiconductors”, “ISP1122”)  
internal analog overcurrent  
detection enable  
0
internal analog overcurrent detection  
circuit disabled; overcurrent pins OCn  
function as digital inputs (TTL level)  
1[1]  
internal analog overcurrent detection  
circuit enabled  
C7, C6  
MaxPower[3]  
00[1]  
1X  
100 mA (MaxPower = 32H)  
500 mA (MaxPower = FAH)  
0 mA (MaxPower = 00H)  
01  
[1] Default value at reset if no external EEPROM is present.  
[2] Modifies the Hub Descriptor field ‘bPwrOn2PwrGood’, see Table 14.  
[3] Modifies the Hub Descriptor field ‘MaxPower’, see Table 14.  
11. Hub power modes  
USB hubs can either be self-powered or bus-powered.  
Self-powered — Self-powered hubs have a 5 V local power supply on board which  
provide power to the hub and the downstream ports. The USB Specification Rev. 1.1  
requires that these hubs limit the current to 500 mA per downstream port and report  
overcurrent conditions to the host. The hub may optionally draw 100 mA from the  
USB supply (VBUS) to power the interface functions (hybrid-powered).  
Bus-powered — Bus-powered hubs obtain all power from the host or an upstream  
self-powered hub. The maximum current is 100 mA per downstream port. Current  
limiting and reporting of overcurrent conditions are both optional.  
Power switching of downstream ports can be done individually or ganged, where all  
ports are switched simultaneously with one power switch. The ISP1122 supports both  
modes, which can be selected using input INDV (see Table 4).  
11.1 Voltage drop requirements  
11.1.1 Self-powered hubs  
Self-powered hubs are required to provide a minimum of 4.75 V to its output port  
connectors at all legal load conditions. To comply with Underwriters Laboratory Inc.  
(UL) safety requirements, the power from any port must be limited to 25 W (5 A at  
5 V). Overcurrent protection may be implemented on a global or individual basis.  
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Assuming a 5 V ± 3% power supply the worst case supply voltage is 4.85 V. This only  
allows a voltage drop of 100 mV across the hub printed-circuit board (PCB) to each  
downstream connector. This includes a voltage drop across:  
Power supply connector  
Hub PCB (power and ground traces, ferrite beads)  
Power switch (FET on-resistance)  
Overcurrent sense device.  
PCB resistance and power supply connector resistance may cause a drop of 25 mV,  
leaving only 75 mV as the voltage drop allowed across the power switch and  
overcurrent sense device. The individual voltage drop components are shown in  
Figure 6.  
voltage drop  
75 mV  
voltage drop  
25 mV  
4.85 V(min)  
4.75 V(min)  
V
5 V  
+
BUS  
POWER SUPPLY  
± 3% regulated  
hub board  
D+  
D−  
(1)  
downstream  
port  
connector  
low-ohmic  
PMOS switch  
resistance  
ISP1122  
power  
switch  
GND  
SHIELD  
MGR781  
(1) Includes PCB traces, ferrite beads, etc.  
Fig 6. Typical voltage drop components in self-powered mode using individual overcurrent detection.  
In case of global overcurrent detection an increased voltage drop is needed for the  
overcurrent sense device (in this case a low-ohmic resistor). This can be realized by  
using a special power supply of 5.1 V ± 3%, as shown in Figure 7.  
voltage drop  
100 mV  
voltage drop  
75 mV  
voltage drop  
25 mV  
4.95 V(min)  
4.75 V(min)  
V
5.1 V KICK-UP  
POWER SUPPLY  
± 3% regulated  
+
BUS  
low-ohmic  
sense resistor  
for overcurrent  
detection  
hub board  
resistance  
D+  
D−  
(1)  
downstream  
port  
connector  
low-ohmic  
PMOS switch  
ISP1122  
power  
GND  
SHIELD  
switch  
MGR782  
(1) Includes PCB traces, ferrite beads, etc.  
Fig 7. Typical voltage drop components in self-powered mode using global overcurrent detection.  
11.1.2 Bus-powered hubs  
Bus-powered hubs are guaranteed to receive a supply voltage of 4.5 V at the  
upstream port connector and must provide a minimum of 4.4 V to the downstream  
port connectors. The voltage drop of 100 mV across bus-powered hubs includes:  
Hub PCB (power and ground traces, ferrite beads)  
Power switch (FET on-resistance)  
Overcurrent sense device.  
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The PCB resistance may cause a drop of 25 mV, which leaves 75 mV for the power  
switch and overcurrent sense device. The voltage drop components are shown in  
Figure 8.  
For bus-powered hubs overcurrent protection is optional. It may be implemented for  
all downstream ports on a global or individual basis.  
voltage drop  
75 mV  
voltage drop  
25 mV  
4.50 V(min)  
4.40 V(min)  
V
V
BUS  
BUS  
hub board  
resistance  
D+  
D−  
D+  
D−  
(1)  
upstream  
port  
connector  
downstream  
port  
connector  
low-ohmic  
PMOS switch  
ISP1122  
power  
switch  
GND  
GND  
SHIELD  
SHIELD  
MGR783  
(1) Includes PCB traces, ferrite beads, etc.  
Fig 8. Typical voltage drop components in bus-powered mode (no overcurrent detection).  
12. Overcurrent detection  
The ISP1122 has an analog overcurrent detection circuit for monitoring downstream  
port lines. This circuit automatically reports an overcurrent condition to the host and  
turns off the power to the faulty port. The host must reset the condition flag.  
Pins OC1 to OC5/GOC are used for individual port overcurrent detection. Pin  
OC5/GOC can also be used for global overcurrent detection. This is controlled by  
input INDV (see Table 4).  
The overcurrent detection circuit can be switched off using an external EEPROM (see  
Table 23). In this case, the overcurrent pins OCn function as logic inputs (TTL level).  
12.1 Overcurrent circuit description  
The integrated overcurrent detection circuit of ISP1122 senses the voltage drop  
across the power switch or an extra low-ohmic sense resistor. When the port draws  
too much current, the voltage drop across the power switch exceeds the trip voltage  
threshold (Vtrip). The overcurrent circuit detects this and switches off the power  
switch control signal after a delay of 15 ms (ttrip). This delay acts as a ‘debounce’  
period to minimize false tripping, especially during the inrush current produced by ‘hot  
plugging’ of a USB device.  
12.2 Power switch selection  
From the voltage drop analysis given in Figure 6, Figure 7 and Figure 8, the power  
switch has a voltage drop budget of 75 mV. For individual self-powered mode, the  
current drawn per port can be up to 500 mA. Thus the power switch should have  
maximum on-resistance of 150 m.  
If the voltage drop due to the hub board resistance can be minimized, the power  
switch can have more voltage drop budget and therefore a higher on-resistance.  
Power switches with a typical on-resistance of around 100 mfit into this application.  
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The ISP1122 overcurrent detection circuit has been designed with a nominal trip  
voltage (Vtrip) of 85 mV. This gives a typical trip current of approximately 850 mA for  
a power switch with an on-resistance of 100 m1.  
12.3 Tuning the overcurrent trip voltage  
set the desired trip current. This is done by inserting tuning resistors at pins SP/BP or  
OCn (see Figure 9). Rtu tunes up the trip voltage Vtrip and Rtd tunes it down  
according to Equation 1.  
Vtrip = Vtrip(intrinsic) + Iref Rtu IOC Rtd  
(1)  
with Iref(nom) = 5 µA and IOC(nom) = 0.5 µA.  
handbook, halfpage  
low-ohmic  
handbook, halfpage  
low-ohmic  
PMOS switch  
PMOS switch  
V
V
CC  
BUS  
I
I
I
ref  
OC  
OC  
R
R
R
td  
tu  
td  
V
SP/BP  
OCn  
V
SP/BP  
OCn  
CC  
CC  
ISP1122  
ISP1122  
MBL042  
MBL043  
Iref(nom) = 5 µA  
IOC(nom) = 0.5 µA  
IOC(nom) = 0.5 µA  
a. Self-powered mode.  
Fig 9. Tuning the overcurrent trip voltage.  
b. Bus-powered mode.  
12.4 Reference circuits  
Some typical examples of port power switching and overcurrent detection modes are  
given in Figure 10 to Figure 13.  
The RC circuit (47 kand 0.1 µF) around the PMOS switch provides for soft turn-on.  
The series resistor connecting the SP/BP pin to VCC tunes up the overcurrent trip  
voltage slightly (see Figure 9). In the schematic diagram the resistor separates the  
net names for pins VCC and SP/BP. This allows an automatic router to use a wide  
trace for VCC and a narrow trace to connect pin SP/BP.  
1. The following PMOS power switches have been tested to work well with the ISP1122: Philips PHP109, Vishay Siliconix Si2301DS,  
Fairchild FDN338P.  
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downstream  
ports  
low-ohmic  
PMOS switch  
ferrite bead  
+4.85 V(min)  
5 V  
POWER SUPPLY  
± 3%  
V
+
BUS  
+4.75 V  
(min)  
1
120  
D+  
D−  
0.1 µF  
µF  
1
2
3
47 kΩ  
GND  
SHIELD  
low-ohmic  
PMOS switch  
ferrite bead  
330 kΩ  
V
BUS  
(5×)  
+4.75 V  
(min)  
2
120  
µF  
D+  
D−  
0.1 µF  
47 kΩ  
GND  
SHIELD  
low-ohmic  
PMOS switch  
+4.85 V(min)  
ferrite bead  
V
CC  
V
PSW1/GL1  
PSW2/GL2  
BUS  
+4.75 V  
(min)  
3
120  
µF  
D+  
D−  
GND  
0.1 µF  
47 kΩ  
GND  
SHIELD  
PSW3/GL3  
100 Ω  
to  
1 kΩ  
PSW4/GL4  
low-ohmic  
PMOS switch  
ferrite bead  
PSW5/GL5/GPSW  
V
BUS  
+4.75 V  
(min)  
4
120  
µF  
D+  
D−  
0.1 µF  
4
47 kΩ  
INDV  
GND  
SHIELD  
SP/BP  
low-ohmic  
PMOS switch  
ferrite bead  
OPTION  
V
BUS  
+4.75 V  
(min)  
5
120  
µF  
D+  
D−  
0.1 µF  
ISP1122  
5
47 kΩ  
GND  
SHIELD  
OC1  
OC2  
OC3  
OC4  
MGR784  
OC5/GOC  
Power switches 1 to 5 are low-ohmic PMOS devices as specified in Section 12.2.  
Fig 10. Mode 5: self-powered hub; individual port power switching; individual overcurrent detection.  
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ISP1122  
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downstream  
d
ports  
ferrite bead  
+4.95 V(min)  
V
+
5.1 V KICK-UP  
POWER SUPPLY  
BUS  
+4.75 V  
(min)  
120  
µF  
D+  
D−  
± 3%  
low-ohmic  
1
2
3
4
5
sense resistor  
for overcurrent  
detection  
GND  
SHIELD  
330  
kΩ  
+4.95 V(min)  
ferrite bead  
V
CC  
V
BUS  
PSW1/GL1  
PSW2/GL2  
PSW3/GL3  
+4.75 V  
(min)  
120  
µF  
D+  
D−  
GND  
low-ohmic  
PMOS switch  
GND  
SHIELD  
100 Ω  
to  
1 kΩ  
0.1 µF  
PSW4/GL4  
ferrite bead  
47 kΩ  
V
PSW5/GL5/GPSW  
BUS  
+4.75 V  
(min)  
120  
µF  
D+  
D−  
GND  
SHIELD  
INDV  
SP/BP  
ferrite bead  
OPTION  
V
BUS  
+4.75 V  
(min)  
120  
µF  
D+  
D−  
ISP1122  
GND  
SHIELD  
OC1  
OC2  
OC3  
OC4  
ferrite bead  
V
BUS  
+4.75 V  
(min)  
120  
µF  
D+  
D−  
OC5/GOC  
GND  
SHIELD  
MGR785  
Power switch is low-ohmic PMOS device as specified in Section 12.2.  
Fig 11. Mode 1: self-powered hub; ganged port power switching; global overcurrent detection.  
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upstream  
port  
downstream  
ports  
low-ohmic  
PMOS switch  
ferrite bead  
+4.50 V(min)  
V
V
BUS  
BUS  
+4.40 V  
(min)  
1
120  
D+  
D−  
D+  
D−  
0.1 µF  
µF  
1
2
3
4
47 kΩ  
GND  
GND  
SHIELD  
330 kΩ  
(4×)  
SHIELD  
low-ohmic  
PMOS switch  
ferrite bead  
V
BUS  
+4.40 V  
(min)  
2
120  
µF  
D+  
D−  
0.1 µF  
PSW1/GL1  
V
CC  
47 kΩ  
GND  
SHIELD  
PSW2/GL2  
PSW3/GL3  
GND  
low-ohmic  
PMOS switch  
ferrite bead  
PSW4/GL4  
V
BUS  
+4.40 V  
(min)  
3
120  
µF  
D+  
D−  
PSW5/GL5/GPSW  
0.1 µF  
47 kΩ  
GND  
SHIELD  
INDV  
low-ohmic  
PMOS switch  
ferrite bead  
V
SP/BP  
OPTION  
BUS  
+4.40 V  
(min)  
4
120  
µF  
D+  
D−  
0.1 µF  
47 kΩ  
GND  
SHIELD  
ISP1122  
MGR786  
OC1  
OC2  
OC3  
OC4  
OC5/GOC  
Power switches 1 to 4 are low-ohmic PMOS devices as specified in Section 12.2.  
Fig 12. Mode 4: bus-powered hub; individual port power switching; individual overcurrent detection.  
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ISP1122  
USB stand-alone hub  
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upstream  
port  
downstream  
ports  
ferrite bead  
+4.50 V(min)  
V
V
BUS  
BUS  
+4.40 V  
(min)  
120  
D+  
D−  
D+  
D−  
µF  
1
2
3
4
GND  
GND  
SHIELD  
SHIELD  
330  
kΩ  
ferrite bead  
V
BUS  
+4.40 V  
(min)  
120  
µF  
D+  
D−  
V
PSW1/GL1  
PSW2/GL2  
PSW3/GL3  
CC  
GND  
SHIELD  
low-ohmic  
PMOS switch  
GND  
ferrite bead  
0.1 µF  
PSW4/GL4  
V
BUS  
47 kΩ  
+4.40 V  
(min)  
120  
µF  
D+  
D−  
PSW5/GL5/GPSW  
INDV  
GND  
SHIELD  
SP/BP  
ferrite bead  
OPTION  
V
BUS  
+4.40 V  
(min)  
120  
µF  
D+  
D−  
ISP1122  
GND  
SHIELD  
MGR787  
OC1  
OC2  
OC3  
OC4  
OC5/GOC  
Power switch is low-ohmic PMOS device as specified in Section 12.2.  
Fig 13. Mode 0: bus-powered hub; ganged port power switching; global overcurrent detection.  
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13. Limiting values  
Table 24: Absolute maximum ratings  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCC  
Parameter  
Conditions  
Min  
0.5  
0.5  
-
Max  
Unit  
V
supply voltage  
+6.0  
VI  
input voltage  
VCC + 0.5  
V
Ilatchup  
Vesd  
Tstg  
latchup current  
VI < 0 or VI > VCC  
200  
mA  
V
[1] [2]  
electrostatic discharge voltage  
storage temperature  
total power dissipation  
ILI < 15 µA  
-
±4000[3]  
+150  
60  
-
°C  
mW  
Ptot  
95  
[1] Equivalent to discharging a 100 pF capacitor via a 1.5 kresistor (Human Body Model).  
[2] Values are given for device only; in-circuit Vesd(max) = ±8000 V.  
[3] For open-drain pins Vesd(max) = ±2000 V.  
Table 25: Recommended operating conditions  
Symbol  
VCC  
Parameter  
Conditions  
Min  
Max  
5.5  
5.5  
3.6  
Unit  
supply voltage  
input voltage  
4.0  
0
V
V
V
VI  
VI(AI/O)  
input voltage on analog I/O pins  
0
(D+/D)  
VO(od)  
Tamb  
open-drain output pull-up voltage  
operating ambient temperature  
0
5.5  
V
40  
+85  
°C  
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14. Static characteristics  
Table 26: Static characteristics; supply pins  
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = 40 to +85 °C; unless otherwise specified.  
Symbol  
Vreg(3.3)  
ICC  
Parameter  
Conditions  
Min  
3.0[1]  
Typ  
3.3  
18  
-
Max  
3.6  
-
Unit  
V
regulated supply voltage  
operating supply current  
suspend supply current  
-
-
mA  
µA  
ICC(susp  
)
1.5 kpull-up on upstream  
270  
port D+ (pin DP0)  
no pull-up on upstream port  
-
-
80  
µA  
D+ (pin DP0)  
[1] In ‘suspend’ mode the minimum voltage is 2.7 V.  
Table 27: Static characteristics: digital pins  
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = 40 to +85 °C; unless otherwise specified.  
Symbol  
Input levels  
VIL  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
LOW-level input voltage  
HIGH-level input voltage  
-
-
-
0.8  
-
V
V
VIH  
2.0  
Schmitt trigger inputs  
Vth(LH) positive-going threshold  
1.4  
0.9  
0.4  
-
-
-
1.9  
1.5  
0.7  
V
V
V
voltage  
Vth(HL)  
negative-going threshold  
voltage  
Vhys  
hysteresis voltage  
Output levels  
VOL  
LOW-level output voltage  
(open drain outputs)  
IOL = 6 mA  
-
-
-
-
0.4  
0.1  
V
V
IOL = 20 µA  
Leakage current  
ILI  
input leakage current  
-
-
-
-
±1  
µA  
Open-drain outputs  
IOZ  
OFF-state output current  
±1  
µA  
Table 28: Static characteristics: overcurrent sense pins  
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = 40 to +85 °C; unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
[1]  
[2]  
overcurrent detection  
trip voltage on OCn pins  
V = VCC VOCn  
V = VSP/BP VOCn  
Vtrip  
65  
85  
105  
mV  
[1] Bus-powered mode.  
[2] Self-powered or hybrid-powered mode.  
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Table 29: Static characteristics: analog I/O pins (D+, D)[1]  
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = 40 to +85 °C; unless otherwise specified.  
Symbol  
Input levels  
VDI  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
differential input sensitivity  
|VI(D+) VI(D)  
|
0.2  
0.8  
-
-
-
V
V
VCM  
differential common mode  
voltage  
includes VDI range  
2.5  
VIL  
LOW-level input voltage  
HIGH-level input voltage  
-
-
-
0.8  
-
V
V
VIH  
2.0  
Output levels  
VOL  
VOH  
LOW-level output voltage  
HIGH-level output voltage  
RL = 1.5 kto +3.6V  
-
-
-
0.3  
3.6  
V
V
RL = 15 kto GND  
2.8  
Leakage current  
ILZ  
OFF-state leakage current  
-
-
-
-
±10  
µA  
Capacitance  
CIN  
transceiver capacitance  
pin to GND  
20  
pF  
Resistance  
[2]  
ZDRV  
driver output impedance  
input impedance  
steady-state drive  
28  
10  
-
-
44  
-
ZINP  
MΩ  
Termination  
[3]  
VTERM  
termination voltage for  
3.0[4]  
-
3.6  
V
upstream port pull-up (RPU  
)
[1] D+ is the USB positive data pin (DPn); Dis the USB negative data pin (DMn).  
[2] Includes external resistors of 20 ±1% on both D+ and D.  
[3] This voltage is available at pin Vreg(3.3)  
.
[4] In ‘suspend’ mode the minimum voltage is 2.7 V.  
15. Dynamic characteristics  
Table 30: Dynamic characteristics  
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = 40 to +85 °C; unless otherwise specified.  
Symbol  
Reset  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
tW(RESET)  
pulse width on input RESET  
crystal oscillator running  
crystal oscillator stopped  
10  
-
-
-
-
µs  
2[1]  
ms  
Crystal oscillator  
fXTAL  
crystal frequency  
-
6
-
MHz  
[1] Dependent on the crystal oscillator start-up time.  
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Table 31: Dynamic characteristics: overcurrent sense pins  
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = 40 to +85 °C; unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
[1]  
ttrip  
overcurrent trip response time see Figure 14  
from OCn LOW to PSWn HIGH  
-
-
15  
ms  
[1] Operating modes 0, 1, 4 and 5; see Table 4.  
Table 32: Dynamic characteristics: analog I/O pins (D+, D); full-speed mode[1]  
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = 40 to +85 °C; CL = 50 pF; RPU = 1.5 kon D+ to VTERM.; unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Driver characteristics  
tFR  
rise time  
CL = 50 pF;  
10 to 90% of |VOH VOL  
4
-
-
-
-
20  
ns  
ns  
%
V
|
tFF  
fall time  
CL = 50 pF;  
10 to 90% of |VOH VOL  
4
20  
|
[2]  
FRFM  
differential rise/fall time  
matching (tFR/tFF  
90  
1.3  
111.11  
2.0  
)
[2] [3]  
VCRS  
output signal crossover voltage  
Data source timing  
tDJ1 source differential jitter for  
[2] [3]  
[2] [3]  
see Figure 16  
3.5  
-
-
+3.5  
ns  
ns  
consecutive transitions  
tDJ2  
source differential jitter for  
paired transitions  
4  
+4  
[3]  
[3]  
tFEOPT  
tFDEOP  
source EOP width  
160  
-
-
175  
ns  
ns  
source differential data-to-EOP see Figure 16  
transition skew  
2  
+5  
Receiver timing  
[3]  
[3]  
[3]  
[3]  
tJR1  
receiver data jitter tolerance for see Figure 17  
consecutive transitions  
18.5  
9  
-
-
-
-
+18.5  
+9  
ns  
ns  
ns  
ns  
tJR2  
receiver data jitter tolerance for see Figure 17  
paired transitions  
tFEOPR  
tFST  
receiver SE0 width  
accepted as EOP;  
82  
-
width of SE0 during differential rejected as EOP;  
transition see Figure 18  
Hub timing (downstream ports configured as full-speed)  
-
14  
[3]  
[3]  
tFHDD  
hub differential data delay  
(without cable)  
see Figure 19;  
CL = 0 pF  
-
-
-
44  
ns  
ns  
tFSOP  
data bit width distortion after  
SOP  
5  
+5  
[3]  
[3]  
tFEOPD  
tFHESK  
hub EOP delay relative to tHDD see Figure 20  
hub EOP output width skew see Figure 20  
0
-
-
15  
ns  
ns  
15  
+15  
[1] Test circuit: see Figure 22.  
[2] Excluding the first transition from Idle state.  
[3] Characterized only, not tested. Limits guaranteed by design.  
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Table 33: Dynamic characteristics: analog I/O pins (D+, D); low-speed mode[1]  
VCC = 4.0 to 5.5 V; VGND = 0 V; Tamb = 40 to +85 °C; CL = 50 pF; RPU = 1.5 kon Dto VTERM; unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Driver characteristics  
tLR  
rise time  
CL = 200 to 600 pF;  
10 to 90% of |VOH VOL  
75  
75  
80  
1.3  
-
-
-
-
300  
300  
125  
2.0  
ns  
ns  
%
V
|
tLF  
fall time  
CL = 200 to 600 pF;  
10 to 90% of |VOH VOL  
|
[2]  
LRFM  
differential rise/fall time  
matching (tLR/tLF  
)
[2] [3]  
VCRS  
output signal crossover voltage  
Hub timing (downstream ports configured as low-speed)  
tLHDD  
tLSOP  
hub differential data delay  
see Figure 19  
-
-
-
300  
ns  
ns  
[3]  
data bit width distortion after  
SOP  
60  
+60  
[3]  
[3]  
tLEOPD  
tLHESK  
hub EOP delay relative to tHDD see Figure 20  
hub EOP output width skew see Figure 20  
0
-
-
200  
ns  
ns  
300  
+300  
[1] Test circuit: see Figure 22.  
[2] Excluding the first transition from Idle state.  
[3] Characterized only, not tested. Limits guaranteed by design.  
V
handbook, halfpage  
CC  
V  
trip  
overcurrent  
input  
0 V  
t
trip  
V
CC  
power switch  
output  
MBL032  
0 V  
Overcurrent input: OCn; power switch output: PSWn.  
Reference voltage for overcurrent sensing: VCC (bus-powered mode) or VSP/BP (self-powered mode).  
Fig 14. Overcurrent trip response timing.  
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T
PERIOD  
+3.3 V  
crossover point  
crossover point  
crossover point  
differential  
data lines  
0 V  
MGR870  
consecutive  
transitions  
+ t  
N × T  
PERIOD DJ1  
paired  
transitions  
N × T  
+ t  
PERIOD DJ2  
TPERIOD is the bit duration corresponding with the USB data rate.  
Fig 15. Source differential data jitter.  
T
h
PERIOD  
+3.3 V  
crossover point  
extended  
crossover point  
differential  
data lines  
0 V  
differential data to  
SE0/EOP skew  
N × T + t  
source EOP width: t  
EOPT  
receiver EOP width: t  
EOPR  
PERIOD DEOP  
MGR776  
TPERIOD is the bit duration corresponding with the USB data rate.  
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L.  
Fig 16. Source differential data-to-EOP transition skew and EOP width.  
T
PERIOD  
+3.3 V  
differential  
data lines  
0 V  
MGR871  
t
t
t
JR  
JR1  
JR2  
consecutive  
transitions  
N × T  
+ t  
PERIOD JR1  
paired  
transitions  
N × T  
+ t  
PERIOD JR2  
TPERIOD is the bit duration corresponding with the USB data rate.  
Fig 17. Receiver differential data jitter.  
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handbook, halfpage  
t
FST  
+3.3 V  
V
differential  
data lines  
IH(min)  
0 V  
MGR872  
Fig 18. Receiver SE0 width tolerance.  
+3.3 V  
h
crossover  
point  
crossover  
point  
upstream  
differential  
data lines  
downstream  
differential  
data  
0 V  
hub delay  
downstream  
hub delay  
upstream  
t
t
HDD  
HDD  
+3.3 V  
crossover  
point  
crossover  
point  
downstream  
differential  
data lines  
upstream  
differential  
data  
0 V  
MGR777  
(A) downstream hub delay  
(B) upstream hub delay  
SOP distortion:  
= t  
t
t  
SOP HDD (next J) HDD(SOP)  
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L.  
Fig 19. Hub differential data delay and SOP distortion.  
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+3.3 V  
h
crossover  
point  
extended  
crossover  
point  
extended  
upstream  
differential  
data lines  
downstream  
port  
0 V  
t
t
t
t
EOP−  
EOP+  
EOP−  
EOP+  
+3.3 V  
downstream  
differential  
data lines  
crossover  
point  
extended  
crossover  
point  
extended  
upstream  
end of cable  
0 V  
MGR778  
(A) downstream EOP delay  
(B) upstream EOP delay  
EOP delay:  
t
= max (t  
, t  
)
EOP  
EOPEOP+  
EOP delay relative to t  
:
HDD  
t
= t  
t  
EOPD EOP HDD  
EOP skew:  
= t  
t
t  
HESK EOP+ EOP−  
Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L.  
Fig 20. Hub EOP delay and EOP skew.  
Table 34: Dynamic characteristics: I2C-bus pins (SDA, SCL)  
VCC and Tamb within recommended operating range; VDD = +5 V; VSS = VGND ; VIL and VIH between VSS and VDD  
.
Symbol  
fSCL  
Parameter  
Conditions  
Min  
0
Typ  
93.75[1]  
Max  
Unit  
kHz  
µs  
SCL clock frequency  
bus free time  
fXTAL = 6 MHz  
100  
tBUF  
4.7  
250  
4.0  
4.7  
4.0  
-
-
-
-
-
-
-
-
-
-
-
-
tSU;STA  
tHD;STA  
tLOW  
START condition set-up time  
hold time START condition  
SCL LOW time  
-
ns  
-
µs  
-
µs  
tHIGH  
tr  
SCL HIGH time  
-
µs  
[2]  
SCL and SDA rise time  
SCL and SDA fall time  
data set-up time  
1000  
300  
-
ns  
tf  
-
ns  
tSU;DAT  
tHD;DAT  
tVD;DAT  
250  
0
ns  
data hold time  
-
µs  
SCL LOW to data out valid  
time  
-
0.4  
µs  
tSU;STO  
Cb  
STOP condition set-up time  
4.0  
-
-
-
-
µs  
capacitive load for each bus  
line  
400  
pF  
[1] fSCL = 164fXTAL  
.
[2] Rise time is determined by Cb and pull-up resistor value Rp (typ. 4.7 k).  
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h
SDA  
t
t
t
t
t
HD;STA  
BUF  
LOW  
r
f
SCL  
P
P
S
S
t
t
t
t
t
t
HD;STA  
HD;STA  
HIGH  
SU;DAT  
SU;STA  
SU;STO  
MGR779  
Fig 21. I2C-bus timing.  
16. Test information  
The dynamic characteristics of the analog I/O ports (D+ and D) as listed in Table 32  
and Table 33, were determined using the circuit shown in Figure 22.  
V
handbook, halfpage  
D.U.T.  
reg(3.3)  
test point  
R
PU  
1.5 kΩ  
S1  
20 Ω  
test  
S1  
C
15 kΩ  
L
D/LS closed  
D+/LS open  
D/FS open  
closed  
D+/FS  
MGR775  
Load capacitance:  
CL = 50 pF (full-speed mode)  
CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing).  
Speed selection:  
full-speed mode (FS): 1.5 kpull-up resistor on D+  
low-speed mode (LS): 1.5 kpull-up resistor on D.  
Fig 22. Load impedance for D+ and D- pins.  
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17. Package outline  
SO32: plastic small outline package; 32 leads; body width 7.5 mm  
SOT287-1  
D
E
A
X
c
y
H
v
M
A
E
Z
17  
32  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
16  
1
w M  
detail X  
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
E
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
max.  
0.3  
0.1  
2.45  
2.25  
0.49  
0.36  
0.27 20.7  
0.18 20.3  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.2  
1.0  
0.95  
0.55  
mm  
2.65  
0.25  
0.01  
1.27  
0.050  
1.4  
0.25  
0.01  
0.25  
0.01  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.086  
0.02 0.011 0.81  
0.01 0.007 0.80  
0.30  
0.29  
0.419  
0.394  
0.043 0.047  
0.016 0.039  
0.037  
0.022  
inches 0.10  
0.004  
0.055  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
97-05-22  
99-12-27  
SOT287-1  
MO-119  
Fig 23. SO32 package outline.  
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SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)  
SOT232-1  
D
M
E
A
2
A
A
L
1
c
(e )  
w M  
e
Z
1
b
1
M
H
b
32  
17  
pin 1 index  
E
1
16  
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
max.  
A
A
(1)  
(1)  
Z
1
2
w
UNIT  
b
b
c
D
E
e
e
L
M
M
H
1
1
E
min.  
max.  
max.  
1.3  
0.8  
0.53  
0.40  
0.32  
0.23  
29.4  
28.5  
9.1  
8.7  
3.2  
2.8  
10.7  
10.2  
12.2  
10.5  
mm  
4.7  
0.51  
3.8  
1.778  
10.16  
0.18  
1.6  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-04  
SOT232-1  
Fig 24. SDIP32 package outline.  
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LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm  
SOT358-1  
c
y
X
A
24  
17  
25  
16  
Z
E
e
H
E
A
E
(A )  
3
2
A
A
1
w M  
p
θ
b
L
p
pin 1 index  
L
32  
9
detail X  
1
8
e
Z
D
v M  
A
w M  
b
p
D
B
H
v M  
B
D
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
θ
1
2
3
p
E
p
D
E
max.  
7o  
0o  
0.20 1.45  
0.05 1.35  
0.4 0.18 7.1  
0.3 0.12 6.9  
7.1  
6.9  
9.15 9.15  
8.85 8.85  
0.75  
0.45  
0.9  
0.5  
0.9  
0.5  
mm  
1.60  
0.25  
0.8  
1.0  
0.2 0.25 0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
99-12-27  
00-01-19  
SOT358 -1  
136E03  
MS-026  
Fig 25. LQFP32 package outline.  
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18. Soldering  
18.1 Introduction  
This text gives a very brief insight to a complex technology. A more in-depth account  
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit  
Packages (document order number 9398 652 90011).  
There is no soldering method that is ideal for all IC packages. Wave soldering is often  
preferred when through-hole and surface mount components are mixed on one  
printed-circuit board. However, wave soldering is not always suitable for surface  
mount ICs, or for printed-circuit boards with high population densities. In these  
situations reflow soldering is often used.  
18.2 Surface mount packages  
18.2.1 Reflow soldering  
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and  
binding agent) to be applied to the printed-circuit board by screen printing, stencilling  
or pressure-syringe dispensing before package placement.  
Several methods exist for reflowing; for example, infrared/convection heating in a  
conveyor type oven. Throughput times (preheating, soldering and cooling) vary  
between 100 and 200 seconds depending on heating method.  
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface  
temperature of the packages should preferable be kept below 230 °C.  
18.2.2 Wave soldering  
Conventional single wave soldering is not recommended for surface mount devices  
(SMDs) or printed-circuit boards with a high component density, as solder bridging  
and non-wetting can present major problems.  
To overcome these problems the double-wave soldering method was specifically  
developed.  
If wave soldering is used the following conditions must be observed for optimal  
results:  
Use a double-wave soldering method comprising a turbulent wave with high  
upward pressure followed by a smooth laminar wave.  
For packages with leads on two sides and a pitch (e):  
larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be  
parallel to the transport direction of the printed-circuit board;  
smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the  
transport direction of the printed-circuit board.  
The footprint must incorporate solder thieves at the downstream end.  
For packages with leads on four sides, the footprint must be placed at a 45° angle  
to the transport direction of the printed-circuit board. The footprint must  
incorporate solder thieves downstream and at the side corners.  
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During placement and before soldering, the package must be fixed with a droplet of  
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the adhesive is cured.  
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the  
need for removal of corrosive residues in most applications.  
18.2.3 Manual soldering  
Fix the component by first soldering two diagonally-opposite end leads. Use a low  
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time  
must be limited to 10 seconds at up to 300 °C.  
When using a dedicated tool, all other leads can be soldered in one operation within  
2 to 5 seconds between 270 and 320 °C.  
18.3 Through-hole mount packages  
18.3.1 Soldering by dipping or by solder wave  
The maximum permissible temperature of the solder is 260 °C; solder at this  
temperature must not be in contact with the joints for more than 5 seconds. The total  
contact time of successive solder waves must not exceed 5 seconds.  
The device may be mounted up to the seating plane, but the temperature of the  
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).  
If the printed-circuit board has been pre-heated, forced cooling may be necessary  
immediately after soldering to keep the temperature within the permissible limit.  
18.3.2 Manual soldering  
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the  
seating plane or not more than 2 mm above it. If the temperature of the soldering iron  
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit  
temperature is between 300 and 400 °C, contact may be up to 5 seconds.  
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18.4 Package related soldering information  
Table 35: Suitability of IC packages for wave, reflow and dipping soldering methods  
Mounting  
Package  
Soldering method  
Wave  
Reflow[1] Dipping  
Through-hole  
mount  
DBS, DIP, HDIP, SDIP, SIL suitable[2]  
suitable  
Surface mount  
BGA, LFBGA, SQFP,  
TFBGA  
not suitable  
suitable  
suitable  
HBCC, HLQFP, HSQFP,  
HSOP, HTQFP, HTSSOP,  
SMS  
not suitable[3]  
PLCC[4], SO, SOJ  
LQFP, QFP, TQFP  
SSOP, TSSOP, VSO  
suitable  
suitable  
not recommended[4] [5] suitable  
not recommended[6]  
suitable  
[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the  
maximum temperature (with respect to time) and body size of the package, there is a risk that internal  
or external package cracks may occur due to vaporization of the moisture in them (the so called  
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated  
Circuit Packages; Section: Packing Methods.  
[2] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the  
printed-circuit board.  
[3] These packages are not suitable for wave soldering as a solder joint between the printed-circuit board  
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top  
version).  
[4] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave  
direction. The package footprint must incorporate solder thieves downstream and at the side corners.  
[5] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger  
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
[6] Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than  
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
9397 750 07002  
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ISP1122  
USB stand-alone hub  
Philips Semiconductors  
19. Revision history  
Table 36: Revision history  
Rev Date  
CPCN  
Description  
03 20000329  
Product specification, third version; supersedes ISP1122-02 of 4 October 1999  
Table 1 “Ordering information”: table note on LQFP32 availability removed  
Table 23 “Configuration bits”: values of bits C7 and C6 exchanged  
Section 12.4 “Reference circuits”: resistor value for soft turn-on RC-circuit changed from  
10 kto 47 k; see also Figure 10 to 13.  
02 19991004  
Product specification, second version; supersedes initial version ISP1122-01 of  
3 June 1999 (9397 750 05154). Modifications:  
Added note on availability of LQFP32 to Table 1 “Ordering information”  
to 330 k, soft turn-on RC network: capacitor moved and changed to 0.1 µF  
Updated Figure 22 “Load impedance for D+ and D- pins.: VCC -> Vreg(3.3)  
.
01 19990603  
Product specification; initial version.  
9397 750 07002  
© Philips Electronics N.V. 2000. All rights reserved.  
Product specification  
Rev. 03 — 29 March 2000  
45 of 48  
 
 
ISP1122  
USB stand-alone hub  
Philips Semiconductors  
20. Data sheet status  
Datasheet status  
Product status Definition[1]  
Objective specification  
Development  
This data sheet contains the design target or goal specifications for product development. Specification may  
change in any manner without notice.  
Preliminary specification Qualification  
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to make changes at any time without notice in order to improve design and  
supply the best possible product.  
Product specification  
Production  
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any  
time without notice in order to improve design and supply the best possible product.  
[1]  
Please consult the most recently issued data sheet before initiating or completing a design.  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
21. Definitions  
Short-form specification The data in  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
a
short-form specification is  
Right to make changes — Philips Semiconductors reserves the right to  
make changes, without notice, in the products, including circuits, standard  
cells, and/or software, described or contained herein in order to improve  
design and/or performance. Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
licence or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products  
are free from patent, copyright, or mask work right infringement, unless  
otherwise specified.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
23. Licenses  
Purchase of Philips I2C components  
Purchase of Philips I2C components conveys a license  
under the Philips’ I2C patent to use the components in the  
I2C system provided the system conforms to the I2C  
specification defined by Philips. This specification can be  
ordered using the code 9398 393 40011.  
22. Disclaimers  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
24. Trademarks  
ACPI — is an open industry specification for PC power management,  
co-developed by Intel Corp., Microsoft Corp. and Toshiba  
SMBus — is a bus specification for PC power management, developed by  
Intel Corp. based on the I2C-bus from Royal Philips Electronics  
GoodLink — is a trademark of Royal Philips Electronics  
SoftConnect — is a trademark of Royal Philips Electronics  
OnNow — is a trademark of Microsoft Corp.  
9397 750 07002  
© Philips Electronics N.V. 2000 All rights reserved.  
Product specification  
Rev. 03 — 29 March 2000  
 
46 of 48  
           
ISP1122  
USB stand-alone hub  
Philips Semiconductors  
Philips Semiconductors - a worldwide company  
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Vietnam: see Singapore  
Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors,  
International Marketing & Sales Communications,  
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,  
The Netherlands, Fax. +31 40 272 4825  
(SCA69)  
9397 750 07002  
© Philips Electronics N.V. 2000. All rights reserved.  
Product specification  
Rev. 03 — 29 March 2000  
 
47 of 48  
ISP1122  
USB stand-alone hub  
Philips Semiconductors  
PLL clock multiplier. . . . . . . . . . . . . . . . . . . . . 10  
23  
24  
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 46  
Get string descriptor (1) . . . . . . . . . . . . . . . . . 20  
Hardware connections . . . . . . . . . . . . . . . . . . 21  
Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 21  
10.2  
10.3  
© Philips Electronics N.V. 2000.  
Printed in The Netherlands  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or  
contract, is believed to be accurate and reliable and may be changed without notice. No  
liability will be accepted by the publisher for any consequence of its use. Publication  
thereof does not convey nor imply any license under patent- or other industrial or  
intellectual property rights.  
Date of release: 29 March 2000  
Document order number: 9397 750 07002  
 

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